1. Physical properties

The forming shrinkage rate of phenolic molding plastics depends on various factors, such as resin composition, filler type, moisture content, and forming conditions. The linear expansion coefficient of phenolic resin molding compound is closely related to the type of filler. With the increase of inorganic fillers such as glass fibers in the plastic, the linear expansion coefficient decreases, while plastics containing synthetic fibers have a higher linear expansion coefficient.

2. Mechanical properties

The creep resistance of phenolic molding compounds at room temperature varies with the type of filler and temperature dependence. Molding compounds containing inorganic fillers such as mica and asbestos have better creep resistance than those containing organic fillers. Generally speaking, molding materials filled with glass fiber have better tensile strength and bending strength, and are less affected by temperature, while some fillers such as wood powder are prone to moisture absorption This will cause a decrease in bending strength and bending modulus.

3. Electrical performance

Phenolic resin plastic has good electrical properties and high insulation performance at room temperature, such as high volume resistance, surface resistance, and breakdown voltage. It can be used as an insulation material, but its dielectric constant and dielectric loss tangent are relatively large and can only be used as a power frequency insulation material.

4. Corrosion resistance

Phenolic resin without fillers is almost unaffected by inorganic acids and is insoluble in most hydrocarbons and chlorides, as well as ketones and alcohols. But it is not resistant to corrosion from concentrated sulfuric acid, nitric acid, high-temperature chromic acid, etc.